Navegação Computação por Assunto "3D interconnects"
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Exploring hierarchy, adaptability and 3D in NoCs for the next generation of MPSoCs
(2014) [Tese]The demand for systems with high performance has brought the need to increase the number of cores, emerging the called Multi-Processors System-on-Chip (MPSoCs). Also, with the shrinking feature size in deep-submicron era, ...