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dc.contributor.authorSouza, Joel Pereira dept_BR
dc.contributor.authorCima, Carlos Albertopt_BR
dc.contributor.authorFichtner, Paulo Fernando Papaleopt_BR
dc.contributor.authorBoudinov, Henri Ivanovpt_BR
dc.date.accessioned2014-05-31T02:06:45Zpt_BR
dc.date.issued2004pt_BR
dc.identifier.issn0021-8979pt_BR
dc.identifier.urihttp://hdl.handle.net/10183/95828pt_BR
dc.description.abstractIn this paper we discuss the structural modifications observed in a buried amorphous Si (α-Si) layer containing high oxygen concentration level (up to ~ 3 at.%) after being implanted at elevated temperature with 16O+ ions. For implants conducted at temperatures lower than 150°C, the α-Si layer expands via layer by layer amorphization at the front and back amorphous–crystalline (a–c) interfaces. When performed at temperatures above 150°C, the implants lead to the narrowing of the buried a-Si layer through ion beam-induced epitaxial crystallization at both a–c interfaces. Cross section transmission electron microscopy analysis of samples implanted at 400°C revealed an array of microtwins and a dislocation network band in the recrystallized material. In samples implanted at 550°C, only a buried dislocation network band is observed.en
dc.format.mimetypeapplication/pdfpt_BR
dc.language.isoengpt_BR
dc.relation.ispartofJournal of applied physics. Vol. 95, no. 3 (Feb. 2004), p. 877-880pt_BR
dc.rightsOpen Accessen
dc.subjectAmorfizacaopt_BR
dc.subjectSemicondutores amorfospt_BR
dc.subjectImplantacao ionicapt_BR
dc.subjectOxigêniopt_BR
dc.subjectRecristalizacaopt_BR
dc.subjectSilíciopt_BR
dc.subjectMicroscopia eletrônica de transmissãopt_BR
dc.subjectImplantação de íonspt_BR
dc.titleAmorphization/recrystallization of buried amorphous silicon layer induced by oxygen ion implantationpt_BR
dc.typeArtigo de periódicopt_BR
dc.identifier.nrb000399224pt_BR
dc.type.originEstrangeiropt_BR


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